Recovery dynamics of a gap-engineered transmon after a quasiparticle burst
Gap-engineered transmons show reduced sensitivity to quasiparticle bursts. Burst rates drop by a factor of a few, but elevated substrate temperature during radiation impacts lets quasiparticles overcome the engineered gap. Relaxation recovers in ~0.7 ms, while chip heating persists for several milliseconds, revealing limits of gap engineering without improved phonon evacuation.
doi.org/10.48550/arXiv.2505.08104

